At TSMC’s 2024 Technology Symposium exhibit in Santa Clara, CA and Workshop in Austin, TX, Alchip Technologies, Ltd. showcased its accomplishments and plans for the future. The company’s focus was on its advanced technology and chiplet design strategies. Alchip will also be participating in TSMC NA Technology Workshops in Boston, MA as well as Technology Symposiums in Europe, Taiwan, China, and Japan.
During the event, Alchip emphasized its expertise in high-performance computing design and its success in managing multiple complex projects. The company highlighted its full reticle size designs exceeding 800mm² and utilizing cutting-edge FinFET technology. Alchip engineers detailed their record-setting advanced package production, including CoWoS® designs on advanced nodes, high power levels, reticle interposers, and large packages in production.
Alchip also emphasized its strong industry partnerships, such as its involvement with TSMC Open Innovation Platform® (OIP) Value Chain Alliance (VCA) and 3DFabricTM Alliance. The company’s reputation as a high-performance ASIC leader is built on its expertise in advanced 2.5D/3DIC design, CoWoS/chiplet design, and manufacturing management. Customers of Alchip include global leaders in various electronic product categories.
Founded in 2003 and headquartered in Taipei, Taiwan