Alchip Technologies unveiled its latest advancements and future direction at TSMC 2024 North America Technology Symposiums in Santa Clara, CA, and Austin, TX. The focus of their exhibit was on advanced technology and chiplet design plans. Alchip is set to participate in TSMC NA Technology Workshops in Boston, MA, and Technology Symposiums in Europe, Taiwan, China, and Japan as well.
At the booth, Alchip showcased its expertise in high-performance computing design within the ASIC industry. They highlighted their success with complex projects such as full reticle size designs over 800mm² on cutting-edge FinFET technology. Additionally, they demonstrated their advanced package production capabilities such as CoWoS® designs on advanced nodes, power levels exceeding 1000W, and packages larger than 70x80mm2 that are currently in production.
The company emphasized the importance of strong industry partnerships. They are members of TSMC Open Innovation Platform® (OIP) Value Chain Alliance (VCA) and 3DFabricTM Alliance. Alchip provides silicon design and production services for system companies developing complex and high-volume ASICs and SoCs. They offer faster time-to-market and cost-effective solutions for SoC design across various process technologies.
Founded in 2003 and headquartered in Taipei, Taiwan, Alchip Technologies has established itself as a high-performance ASIC leader through its expertise in 2.5D/3DIC design, CoWoS/chiplet design